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Thermal, Power Delivery and Reliability Management for 3D ICS
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| 자료유형 | E-Book |
|---|---|
| 개인저자 | Yang, Zhiyuan. |
| 단체저자명 | University of Maryland, College Park. Electrical Engineering. |
| 서명/저자사항 | Thermal, Power Delivery and Reliability Management for 3D ICS. |
| 발행사항 | [S.l.] : University of Maryland, College Park., 2018 |
| 발행사항 | Ann Arbor : ProQuest Dissertations & Theses, 2018 |
| 형태사항 | 210 p. |
| 소장본 주기 | School code: 0117. |
| ISBN | 9780438144828 |
| 일반주기 |
Source: Dissertation Abstracts International, Volume: 79-12(E), Section: B.
Adviser: Ankur Srivastava. |
| 요약 | Three-dimensional (3D) integration technology is promising to continuously improve the performance of electronic devices by vertically stacking multiple active layers and connecting them with Through-Silicon-Vias (TSVs). Meanwhile, the thermal a |
| 요약 | In 3D ICs, the heat flux will easily exceed the capability of the traditional air cooling. Therefore, several aggressive cooling methods are applied to remove heat from the 3D IC, which include micro-fluidic cooling, the phase change material ba |
| 요약 | Since the activity of 3D ICs cannot be completely estimated at the design stage, the run-time management, besides design-time methods, is required to address the thermal, power and reliability problems in 3D ICs. However, the vertically stacked |
| 일반주제명 | Computer engineering. |
| 언어 | 영어 |
| 기본자료 저록 | Dissertation Abstracts International79-12B(E). Dissertation Abstract International |
| 대출바로가기 | http://www.riss.kr/pdu/ddodLink.do?id=T14997531 |
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| No. | 등록번호 | 청구기호 | 소장처 | 도서상태 | 반납예정일 | 예약 | 서비스 | 매체정보 |
|---|---|---|---|---|---|---|---|---|
| 1 | WE00026950 | 621.3 | 가야대학교/전자책서버(컴퓨터서버)/ | 대출가능 |
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