| LDR | | 02061nmm uu200397 4500 |
| 001 | | 000000332623 |
| 005 | | 20240805171133 |
| 008 | | 181129s2018 |||||||||||||||||c||eng d |
| 020 | |
▼a 9780438144828 |
| 035 | |
▼a (MiAaPQ)AAI10789820 |
| 035 | |
▼a (MiAaPQ)umd:18897 |
| 040 | |
▼a MiAaPQ
▼c MiAaPQ
▼d 248032 |
| 082 | 0 |
▼a 621.3 |
| 100 | 1 |
▼a Yang, Zhiyuan.
▼0 (orcid)0000-0003-1365-0777 |
| 245 | 10 |
▼a Thermal, Power Delivery and Reliability Management for 3D ICS. |
| 260 | |
▼a [S.l.] :
▼b University of Maryland, College Park.,
▼c 2018 |
| 260 | 1 |
▼a Ann Arbor :
▼b ProQuest Dissertations & Theses,
▼c 2018 |
| 300 | |
▼a 210 p. |
| 500 | |
▼a Source: Dissertation Abstracts International, Volume: 79-12(E), Section: B. |
| 500 | |
▼a Adviser: Ankur Srivastava. |
| 502 | 1 |
▼a Thesis (Ph.D.)--University of Maryland, College Park, 2018. |
| 520 | |
▼a Three-dimensional (3D) integration technology is promising to continuously improve the performance of electronic devices by vertically stacking multiple active layers and connecting them with Through-Silicon-Vias (TSVs). Meanwhile, the thermal a |
| 520 | |
▼a In 3D ICs, the heat flux will easily exceed the capability of the traditional air cooling. Therefore, several aggressive cooling methods are applied to remove heat from the 3D IC, which include micro-fluidic cooling, the phase change material ba |
| 520 | |
▼a Since the activity of 3D ICs cannot be completely estimated at the design stage, the run-time management, besides design-time methods, is required to address the thermal, power and reliability problems in 3D ICs. However, the vertically stacked |
| 590 | |
▼a School code: 0117. |
| 650 | 4 |
▼a Computer engineering. |
| 690 | |
▼a 0464 |
| 710 | 20 |
▼a University of Maryland, College Park.
▼b Electrical Engineering. |
| 773 | 0 |
▼t Dissertation Abstracts International
▼g 79-12B(E). |
| 773 | |
▼t Dissertation Abstract International |
| 790 | |
▼a 0117 |
| 791 | |
▼a Ph.D. |
| 792 | |
▼a 2018 |
| 793 | |
▼a English |
| 856 | 40 |
▼u http://www.riss.kr/pdu/ddodLink.do?id=T14997531
▼n KERIS |
| 980 | |
▼a 201812
▼f 2019 |
| 990 | |
▼a 관리자 |