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Using lasers as safe alternatives for adhesive bonding : emerging research and opportunities /
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| 자료유형 | E-Book |
|---|---|
| 개인저자 | Ciecin?ska, Barbara Ewa, 1972-, author. |
| 서명/저자사항 | Using lasers as safe alternatives for adhesive bonding :emerging research and opportunities /Barbara Ewa Ciecin?ska. |
| 발행사항 | Hershey, PA : Engineering Science Reference, an imprint of IGI Global, [2020] |
| 형태사항 | 1 online resource (xi, 248 pages) : color illustrations. |
| 총서사항 | Advances in chemical and materials engineering (ACME) book series |
| 소장본 주기 | Added to collection customer.56279.3 |
| ISBN | 9781799846352 1799846350 9781799846369 1799846369 |
| 일반주기 |
"Research Insights" -- taken from front cover.
|
| 서지주기 | Includes bibliographical references and index. |
| 요약 | "This book presents various structural materials that can be glued together using adhesives and various types of substances of natural and synthetic origin that are used for adhesive bonding"-- |
| 일반주제명 | Adhesives. Lasers -- Industrial applications. Adhesives. Lasers -- Industrial applications. |
| 언어 | 영어 |
| 기타형태 저록 | Print version:Ciecin?ska, Barbara Ewa, 1972-Using lasers as safe alternatives for adhesive bondingHershey, PA : Engineering Science Reference, an imprint of IGI Global, [2020]9781799846345 |
| 대출바로가기 | http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=2490846 |
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| No. | 등록번호 | 청구기호 | 소장처 | 도서상태 | 반납예정일 | 예약 | 서비스 | 매체정보 |
|---|---|---|---|---|---|---|---|---|
| 1 | WE00018694 | 620.1/99 | 가야대학교/전자책서버(컴퓨터서버)/ | 대출가능 |
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