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RF and Microwave Module Level Design and Integration /
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| 자료유형 | E-Book |
|---|---|
| 개인저자 | Almalkawi, Mohammad, author. |
| 서명/저자사항 | RF and Microwave Module Level Design and Integration /Mohammad Almalkawi. |
| 발행사항 | London : The Institution of Engineering and Technology, 2019. |
| 형태사항 | 1 online resource (337 pages) |
| 총서사항 | IET Materials, Circuits and Devices series ;34 |
| 소장본 주기 | Added to collection customer.56279.3 |
| ISBN | 178561360X 9781785613609 |
| 요약 | This book is intended to bring together fundamental concepts and elements needed in the design, integration, and characterization phases of modern radio frequency (RF) and microwave modules and to familiarize the interested reader with the common challenges in this rapidly changing field. While design for manufacturability (DFM) and design for testability (DFT) are two important practices that stress the need for careful attention at the early design stages of a product, module integration to achieve optimal RF performance is an art form that takes years to master. In this context, the objective of this book is to provide the necessary practical and theoretical background needed to tackle a multitude of issues accompanied by the design of contemporary RF modules. The topics covered can serve a broad range of individuals: those just entering the field, graduate-level students, and researchers, as well as practicing engineers seeking new domains to expand their knowledge, understand design tradeoffs, and looking for a quick guide in digesting the several aspects of the RF module design processes and their common challenges. The book comprises eight chapters which discuss: packaging, lumped and distributed passive elements, microwave network analysis, impedance matching networks, electromagnetic field couplings, CAD, components of RF front-end modules, component- and module-level measurements. |
| 일반주제명 | Computer-aided design. Electric circuits. Electric networks, Passive. Electronic circuit design. Electronic packaging. Impedance matching. Lumped elements (Electronics) Microwave circuits. Computer-aided design. Electric circuits. Electric networks, Passive. Electronic circuit design. Electronic packaging. Impedance matching. Lumped elements (Electronics) Microwave circuits. circuit CAD. electromagnetic coupling. electronics packaging. impedance matching. lumped parameter networks. microwave circuits. modules. passive networks. |
| 언어 | 영어 |
| 기타형태 저록 | Print version:9781785613609 Print version:17856135969781785613593 |
| 대출바로가기 | http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=2339154 |
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| No. | 등록번호 | 청구기호 | 소장처 | 도서상태 | 반납예정일 | 예약 | 서비스 | 매체정보 |
|---|---|---|---|---|---|---|---|---|
| 1 | WE00018382 | 621.38411 | 가야대학교/전자책서버(컴퓨터서버)/ | 대출가능 |
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